Difference between revisions of "High-Speed DigRF-v4 Implementation"
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[[File:High-Speed DigRF-v4 Implementation.png|thumb|400px]] | [[File:High-Speed DigRF-v4 Implementation.png|thumb|400px]] | ||
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==Short Description== | ==Short Description== | ||
In state-of-the-art mobile phones, the RF transceiver and the baseband processor are commonly realized as two separate ICs. Regarding the required communication link between these two ICs, the DigRF interface has evolved as the de-facto industry standard, as it specifies an efficient standard way to convey I/Q data and other signals between the two ICs, ensuring the compatibility of ICs provided by different suppliers. The interesting aspect of the DigRF-interface implementation is the high throughput required to support current and next-generation mobile broadband standards. For instance, LTE, the 4G standard recently deployed in Switzerland, provides data rates of up to 384 Mbps, which requires the most recent DigRF version~(DigRF v4) to provide raw data rates over the IC-to-IC link of at least 1.5 Gbps. In this project, you will implement the baseband-side interface of the DigRF v4 standard. The project will be carried out in collaboration with Advanced Circuit Pursuit (ACP) AG. | In state-of-the-art mobile phones, the RF transceiver and the baseband processor are commonly realized as two separate ICs. Regarding the required communication link between these two ICs, the DigRF interface has evolved as the de-facto industry standard, as it specifies an efficient standard way to convey I/Q data and other signals between the two ICs, ensuring the compatibility of ICs provided by different suppliers. The interesting aspect of the DigRF-interface implementation is the high throughput required to support current and next-generation mobile broadband standards. For instance, LTE, the 4G standard recently deployed in Switzerland, provides data rates of up to 384 Mbps, which requires the most recent DigRF version~(DigRF v4) to provide raw data rates over the IC-to-IC link of at least 1.5 Gbps. In this project, you will implement the baseband-side interface of the DigRF v4 standard. The project will be carried out in collaboration with Advanced Circuit Pursuit (ACP) AG. | ||
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Latest revision as of 11:50, 15 April 2015
Contents
Project no Longer Available
Please note that this project is no longer available.
Short Description
In state-of-the-art mobile phones, the RF transceiver and the baseband processor are commonly realized as two separate ICs. Regarding the required communication link between these two ICs, the DigRF interface has evolved as the de-facto industry standard, as it specifies an efficient standard way to convey I/Q data and other signals between the two ICs, ensuring the compatibility of ICs provided by different suppliers. The interesting aspect of the DigRF-interface implementation is the high throughput required to support current and next-generation mobile broadband standards. For instance, LTE, the 4G standard recently deployed in Switzerland, provides data rates of up to 384 Mbps, which requires the most recent DigRF version~(DigRF v4) to provide raw data rates over the IC-to-IC link of at least 1.5 Gbps. In this project, you will implement the baseband-side interface of the DigRF v4 standard. The project will be carried out in collaboration with Advanced Circuit Pursuit (ACP) AG.
Status: Available
- Looking for 1-2 Semester/Master students
- Contact: Sandro Belfanti
Prerequisites
- VLSI I
- MATLAB and VHDL is an advantage
Character
- 50% VHDL
- 50% studying the standard